This CH101 Design Guide shows how to design-in Ultrasonic Sensors of the CH101 family. This guide explains the Ultrasonic operation of CH101 Short Range Ultrasonic Sensor, hardware selection, integration guidelines, performance tuning and calibration with our software and testing. This document is intended to help one attain a general understanding of how the CH101 product works and goes over the design process to design and tune the device for usage.
This document provides information and general guidelines for handling and assembling boards with CH101 and CH201 ultrasonic transceivers. The goal of the processes outlined herein is to prevent damage of ultrasonic transceivers due to mechanical, vacuum and thermal stress caused by the handling process. Any deviation from the recommendations contained in this Application Note should be reviewed by Chirp Microsystems and thoroughly verified prior to implementation in a production environment.
The purpose of this document is to provide recommendations and guidance on the mechanical integration of Chirp CH101 and ICU-10201 ultrasonic sensors in device enclosures. This document will cover the mechanical design, geometry, part and assembly tolerances, material considerations, testing, and best practices for mechanical integration. All dimensions mentioned in this document are in mm, unless otherwise specified.
The purpose of this document is to provide recommendations and guidance on the mechanical integration of Chirp CH201 and ICU-20201 ultrasonic sensors in device enclosures. This document will cover the mechanical design, geometry, part and assembly tolerances, material considerations, testing and best practices for mechanical integration. All dimensions mentioned in this document are in mm, unless otherwise specified.
The module test is a tool developed to test the module builds of the Ultrasonic Time-of-Flight (ToF) sensor product line and for engineering development purposes. It is an autonomous test that checks the functionality and performance of ToF sensors. Its test methods include the following features:
• Checks sensor functionality after the assembly process
• Checks and displays sensor performance data against product specifications and criteria.
• Records sensors data log for traceability and data analysis
• Distinguish different types of failures for binning.
This document provides information on gluing an acoustic interface on to a Chirp sensor module assembly. Recommendations are included for adhesives, gluing instructions and basic verification after installation of horn to the module. The scope of this document includes the following ultrasonic transceiver products:
• CH101
• CH201
• ICU-10201
• ICU-20201