A pair of gyro bias trackers “ML_LEARN_BIAS_FROM_TEMPERATURE” and “ML_BIAS_FROM_TEMPERATURE” allow the Embedded

To create and use a mapping gyro bias to temperature, using the ML_BIAS_FROM_NO_MOTION tracker to discover gyro bias and the IMU/MPU’s built in temperature sensor to determine temperature. The mapping of gyro bias to temperature will stay constant [1] throughout the lifetime of the part, so a bias, once learned, can be used to calibrate the gyro at any time it is at that temperature. When ML_LEARN_BIAS_FROM_TEMPERATURE is active, the Embedded

MotionApps Platform will store bias and temperature information discovered from ML_BIAS_NO_MOTION calibration events. When ML_BIAS_FROM_TEMPERATURE is active, stored bias and temperature information is used to update the gyro bias as temperature changes.

[1] The mapping of gyro bias to temperature is affected by mechanical stress on the sensor package. This includes stress due to soldering, tension or compression of the printed circuit board. More information is available in the IMU/MPU product specification.

The Algorithms for sensor fusion is InvenSense IP, and runs in encrypted form on the DMP or as a binary on the host. Sensor fusion outputs quaternions, which is a 3D representation of the movement of an object in space. As long as the Application is using quaternions, there is no need for the system developer to get burdened with the details of sensor fusion implementation.

The calibration algorithms that are supported in software are No Motion Cal, whenever the Gyro detects a no motion event through the DMP, it immediately triggers a calibration process. There is also a temperature compensation of the Biases, which runs in software on the micro. These calibration routines run in real time on the hardware and micro, and does not need any external equipment.

The motion algorithms has two major components to it, sensor fusion and calibration. Sensor fusion runs on the DMP (in hardware), while calibration runs on the micro. The hardware sensors (Gyro, and Accel) detect motion, while the BSP has manages the I2c, Timer, and Non volatile memory interfaces. The hardware does perform 6-axis (dof) sensor fusion through the dedicated DMP computation engine. The next release of Embedded MPL software will enable 9-axis sensor fusion that runs in a fully self contained fashion on the DMP. Currently the DMP does not support 9-axis sensor fusion due to a degraded performance. We are planning to eventually push full 9-axis operation to the DMP.
10 axis (altitude) sensor fusions can be performed on the MCU by taking the 9-axis sensor fusion results from hardware, and combining with altitude information from a pressure sensor.

The Embedded MotionApps Platform may be ported to any platform which can provide the facilities required by the Motion Library System Layer (MLSL). In summary, the Embedded MotionApps Platform can be used on any system which has access to an IMU/MPU device over an I2C serial bus, can provide an interface to sleep for a number of milliseconds, and can provide a millisecond resolution system clock. For more details, see the Embedded MotionApps Platform User Guide.
The MotionFit SDK is currently tied to the MSP430 MCU from Texas Instruments. There is source code available for modifications but the sensor fusion is locked to this MCU
We recommend Embedded Motion Driver 5.1 for an MCU agnostic approach, this is a very lightweight and portable solution that generates 6-axis sensor fusion

The Embedded MotionApps Platform software is not intended for use on an operating system, but it is possible. For use on Android or Linux operating systems, the MotionApps Platform Library is recommended.

Embedded MotionApps 2.0 as well as Motion Driver use the Digital Motion Processor (DMP™) located on the sensor device to perform 6-axis MotionFusion. The Embedded MotionApps Platform MotionFusion reads sensor fusion results from the DMP using the FIFO buffer.
For 9-axis operation in the MotionFit SDK the micro is required to integrate compass data as well as some calibration routines.

Yes, a flex PCB can be used with MEMS microphones. All of our microphones are actually available on flex PCB evaluation boards so that they can be easily placed in your own system for testing. Handling considerations in the datasheets and application note AN-1068 should be followed during assembly.

Click Products at the top of the main page. There will be various MEMS product lines like Motion, Industrial, Automotive, Microphone, and Ultrasonic/ToF etc. You can choose the desired area and that will take you to the product families and components. Once you click through to a product page for a specific component, you will find all the necessary information toward the end of the page.